Siemens 6ES7314-6CH04-4AB2 Compact CPU

Processing speed: 60 ns/binary instruction.

Working memory: 192 KB, supports 8 MB MMC card expansion loading memory.

Power-off protection: Data persistence is achieved through MMC card to ensure that parameters are not lost after the system restarts.

Integrated I/O interface

Digital quantity: 24 inputs (DI)/16 outputs (DO)

Analog quantity: 4 inputs (AI)/2 outputs (AO), support ±10 V, 0-20 mA and other signal types, accuracy 12 bits.

Temperature measurement: 1 Pt100 thermal resistance input, directly connected to platinum resistance sensor, measurement range - 200°C to + 850°C, accuracy ±0.5°C.

High-speed counter: 4 channels, up to 60 kHz.

Communication capability

PROFIBUS DP: Master/slave interface, 12 Mbps, can connect 125 slaves, and achieve millisecond-level data exchange.

MPI: 12-way connection, used for communication between programmer, HMI and PLC, 187.5 kbps.

RS485: Supports point-to-point communication, compatible with MODBUS RTU protocol (software configuration required).

Power supply and physical specifications

Power supply voltage: 24 V DC, current consumption 880 mA, supports power redundancy.

Protection: IP20 protection, operating temperature 0°C to + 60°C (extended - 25°C to + 70°C).

Front connector: 2×40 pin spring contacts (different from the screw contacts of 4AB1), supports quick plugging and unplugging, suitable for frequent maintenance scenarios.

Communication control: PROFIBUS DP realizes distributed synchronous control and supports isochronous mode.

Counting and positioning: Siemens 6ES7314-6CH04-4AB2 has 4 60kHz counters to measure speed displacement, with PTO and 2.5kHz PWM.

Closed-loop control: Siemens 6ES7314-6CH04-4AB2 integrates PID algorithm and self-tuning parameters.

Diagnostic security: 500 diagnostic records are stored, and passwords and encryption are supported.

Expansion compatibility: Siemens 6ES7314-6CH04-4AB2 supports hot swapping, expansion of 31 modules, and compatibility with old MMC cards.

Manufacturing: production line, packaging machinery control.

Process automation: energy management, chemical reactor monitoring.

Building infrastructure: HVAC, intelligent lighting control.

Logistics and transportation: conveyor line scheduling, parking lot management.

OEM equipment: medical instruments, test bench development.